Transistor of semiconductor device and method for fabricating the same

ABSTRACT

Provided is a transistor of a semiconductor device and a method for fabricating the same. A transistor of a semiconductor device may include: a semiconductor substrate having an active region defined by an isolation layer; a recess trench formed in the active region and disposed to cross the semiconductor substrate in one direction; and a gate line formed in a straight line pattern, overlapping the recess trench and disposed to cross the recess trench at approximately right angles.

CROSS-REFERENCE TO RELATED APPLICATION

The priority of Korean patent application number 10-2007-0064745, filedon Jun. 28, 2007, which is incorporated by reference in its entirety, isclaimed.

FIELD OF INVENTION

The invention relates to a semiconductor device, and more particularly,to a transistor of a semiconductor device and a method for fabricatingthe same.

BACKGROUND OF THE INVENTION

A semiconductor memory device, for example, a dynamic random accessmemory (DRAM) device generally includes: a memory cell array region, acore region, and a peripheral circuit region. The core region includes:a sub-word line driver, a sense amplifier, and a YI transistor. The YItransistor connects a bit line with a segment input/output (I/O) line.Generally, the YI transistor has a wave pattern instead of a straightpattern in order to reduce the size of the core region while ensuringthe proper width thereof.

FIG. 1 illustrates a conventional YI transistor.

Referring to FIG. 1, the YI transistor 110 is disposed to cross anactive region 105 of a semiconductor substrate 100. In order to ensurean effective channel length while preventing an increase of a chip size,the YI transistor 110 on the active region 105 has a wave pattern thatincreases the width W1 of the YI transistor 110. As a result, an areaoccupied by the YI transistor 110 decreases, thereby reducing the sizeof the core region.

However, when a YI transistor is formed in the wave pattern, there is adifference between the target wave pattern and the final resulting wavepattern in terms of the length of the YI transistor. The lengthdifference may be more than 30 nanometers (nm).

Such the large length difference may affect the characteristics of asemiconductor memory device. More particularly, the large lengthdifference degrades critical dimension uniformity of the wave pattern.In addition, an optical proximity correction (OPC) process is not usefulfor correcting pattern distortion because of the length difference.

SUMMARY OF THE INVENTION

Various embodiments of the present invention relate to a transistor of asemiconductor device that may include: a semiconductor substrateincluding an active region defined by an isolation layer, a recesstrench formed in the active region and disposed to cross thesemiconductor substrate in one direction, and a gate line formed in asubstantially straight line pattern, overlapping the recess trench anddisposed to cross the recess trench at approximately right angles.

In one embodiment of the present invention, the isolation layer mayinclude a dummy pattern disposed over the isolation layer betweenadjacent gate lines. The dummy pattern may be formed of a materialsimilar to that of the gate line. The recess trench may be disposedwithin the active region.

In one embodiment of the present invention, the recess trench may beformed in a rectangular type in which a length in the Y-axis directionis greater than that in the X-axis direction. The recess trench may bespaced from an adjacent recess trench by a predetermined distance.

In one embodiment of the present invention, the transistor may beselected from the group consisting of a latch transistor, a sub wordline drive PMOS transistor, a main word line drive transistor, aY-decoder transistor, and a YI transistor.

Various embodiments of the present invention relate to a method forfabricating a transistor of a semiconductor device that may include:forming an isolation layer to define an active region in a semiconductorsubstrate, forming a recess trench in the active region by etching thesemiconductor substrate to a predetermined depth, and forming a gateline in a substantially straight line pattern, overlapping the recesstrench and disposed to cross the recess trench at approximately rightangles.

In one embodiment of the present invention, the forming of the recesstrench may include, forming a photoresist layer pattern having anopening that exposes a portion of the active region and etching theexposed portion using the photoresist layer pattern as a mask. Theopening may be a rectangular type in which a length in the Y-axisdirection is greater than that in the X-axis direction.

In another embodiment of the present invention, the opening may beformed within the active region.

In one embodiment of the present invention, the opening may be formed inan island type.

In one embodiment of the present invention, the forming of the gate linemay include: forming stacked layers for the gate line over thesemiconductor substrate including the recess trench; forming aphotoresist layer pattern over the stacked layers and disposed to crossthe recess trench at approximately right angles in a substantiallystraight line pattern, a portion of the stacked layers being blocked bythe photoresist layer pattern; and forming the gate line by etching thestacked layers using the photoresist layer pattern as a mask.

In one embodiment of the present invention, the method may furtherinclude forming a dummy pattern over the isolation layer while formingthe gate line.

In one embodiment of the present invention, the transistor may beselected from the group consisting of a latch transistor, a sub wordline drive PMOS transistor, a main word line drive transistor, aY-decoder transistor, and a YI transistor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a conventional YI transistor.

FIG. 2 illustrates a schematic diagram of a semiconductor memory device.

FIG. 3 illustrates a circuit diagram of operating circuits in a cellarray region and a core region of a semiconductor memory device.

FIG. 4 illustrates a diagram of a transistor according to one embodimentof the present invention.

FIG. 5A-5B, 6A-6C, 7A-7C, 8A-8C, 9A-9C illustrate a method forfabricating a transistor of a semiconductor device according to oneembodiment of the present invention.

FIGS. 10 and 11 illustrates a transistor formed using a recess trenchaccording to one embodiment of the present invention.

DESCRIPTION OF SPECIFIC EMBODIMENTS

The transistor and the manufacturing method thereof reduces the size ofa core region while ensuring the desired width of a transistor, therebydecreasing line width change and ensuring critical dimension uniformityof a pattern for the transistor.

FIG. 2 illustrates a schematic diagram of a semiconductor memory device,and FIG. 3 illustrates a circuit diagram of operating circuits in a cellarray region and a core region.

Referring to FIG. 2, a semiconductor memory device may be divided intothree regions such as a memory cell array region 200, a core region 240,and a peripheral circuit region (not shown). The memory cell arrayregion 200 may include, for example, word lines, bit lines, and memorycells arranged at positions where the word lines intersect with the bitlines. A desired memory cell may be accessed by selecting acorresponding word line and bit line. The core region 240 and theperipheral circuit region are located on the periphery of the memorycell array region 200 and may include circuits for driving andcontrolling the memory cells.

Referring to FIG. 3, the memory cell array region 200 may include wordlines WL0 and WL1, bit lines BLT0 and BLB0, and capacitors SN0 and SN1.The core region 240 may include a sub word line driver, a senseamplifier 210, an equalizer circuit 220, and a transistor 230. Theperipheral circuit region may include a data/address input/output unitand wiring lines.

The transistor 230 may be used as a connecting transistor that connects,for example, a bit line and a segment input/output line, and is disposedin the core region 240 to select a column for operation of asemiconductor device. In a conventional method, in order to increase thewidth of the transistor 230 and ensure a desired effective channellength while preventing an increase in chip size, the transistor 230 hasa wave pattern. However, when the transistor 230 is formed in the wavepattern, the critical dimension uniformity of the wave pattern isdeteriorated due to change in the length of the transistor 230.Moreover, executing an optical proximity correction (OPC) process on thetransistor 230 may not be useful because the transistor 230 is formed ina wave shape. Accordingly, in one embodiment of the present invention, atransistor is provided to increase effective channel length whilereducing core region size.

FIG. 4 illustrates a diagram of a transistor according to one embodimentof the present invention.

Referring to FIG. 4, the transistor in a core region may include asemiconductor substrate 400, recess trenches 415, and gate lines 420.The semiconductor substrate 400 may include an active region 410 definedby an isolation layer 405. The recess trench 415 may be formed in theactive region 410 to a predetermined depth and disposed to cross thesemiconductor substrate 400 in one direction. The gate line 420 overlapsthe recess trench 415, and may be formed in a substantially straightline pattern and disposed to cross the recess trench 415 atapproximately right angles.

The recess trench 415 may be formed within the active region 410 and maybe formed in a rectangular type in which a length in the Y-axisdirection is greater than that in the X-axis direction. A space, a, isdefined between adjacent recess trenches 415. The number and size of thespaces are determined in consideration of the profile and width of theentire transistor. A dummy pattern 425 may be disposed on the isolationlayer 405 between the gate line 420 a and the gate line 420 b. The dummypattern 425 serves to improve the uniformity of the transistor. Theeffective channel of the transistor made by the above described methodis positioned along the recess trench 415 formed in the active region410. The effective channel length of the transistor increasesproportionally to the depth of the recess trench 415. Therefore, thewidth of the transistor can be shortened by approximately the increasedeffective channel length, so that the entire size of the core region canbe reduced.

Due to the formation of the recess trench 415, by etching the activeregion 410 partially, the entire size of the core region may be reducedwhile the desired width of the transistor is ensured. Thus, the size ofa chip may be reduced.

The above method for ensuring the desired width of the transistor byforming the recess trench 415 in the active region 410 can be used toform, for example, a YI transistor, a latch transistor, a sub word linedrive PMOS transistor, a main word line drive transistor, and a Ydecoder transistor.

FIG. 5A-5B, 6A-6C, 7A-7C, 8A-8C, 9A-9C illustrate a method forfabricating a transistor of a semiconductor device according to oneembodiment of the present invention. FIGS. 10 and 11 illustrate atransistor formed using a recess trench according to one embodiment ofthe present invention.

Referring to FIGS. 5A and 5B, an active region 510 is defined by formingan isolation layer 505 in a core region of a semiconductor substrate500. The active region 510 is formed to be spaced apart from adjacentactive regions 510 by a predetermined distance.

Referring to FIG. 5B, showing a cross-sectional view taken along lineI-I′ of FIG. 5A, a trench 502 is formed in a semiconductor substrate 500and then is filled with an insulation layer. The insulation layer in thetrench 502 is removed by performing, for example, a chemical mechanicalpolishing (CMP) process, such as a planarization process. Accordingly,the isolation layer 505 defining the active region 510 of thesemiconductor substrate 500 is formed. The insulation layer may beformed of high density plasma (HDP) oxide.

Referring to FIG. 6A to 6C, a photoresist layer is coated on thesemiconductor substrate 500. The photoresist layer is then patterned toform a photoresist layer pattern 515 having an opening 520 defining aregion in which a recess trench is to be formed. FIGS. 6B and 6Cillustrate cross-sectional views taken along lines I-I′ and II-II′ ofFIG. 6A. Descriptions of FIGS. 6B and 6C are omitted.

The photoresist layer is formed on the semiconductor substrate 500. Thephotoresist layer may be coated using a spin coating method. Aphotolithography process, which includes a light exposing process and adeveloping process, may be performed on the photoresist layer using alight exposure apparatus and a photomask. The photoresist layer isexposed to light transmitted through the photomask from the lightexposure apparatus. Light receiving portions of the photoresist layerare removed by a developing solution. As a result, the photoresist layerpattern 515 is formed with an opening 520 that exposes a portion of thesurface of the active region 510 in the semiconductor substrate 500. Therecess trench may be formed in a region of the semiconductor substrate500 exposed by the opening 520 of the photoresist layer pattern 515. Theopening 520 may be formed in a rectangular type, in which a length inthe Y-axis direction is greater than that in the X-axis direction. Theopening 520 may be formed in an island type so as not to exceed theactive region 510.

Referring to FIG. 7A to 7C, the region of the semiconductor substrate500 exposed by the opening 520 is etched using the photoresist layerpattern 515 as a mask to form the recess trench 525 to a predetermineddepth in the semiconductor substrate 500. The recess trench 525 may beformed in the active region 510 and may be a rectangular type in which alength in the Y-axis direction is greater than that in the X-axisdirection. In addition, the recess trench 525 may be formed, forexample, in an island type so as not to exceed the active region 510.The photoresist layer pattern 515 is then removed. A space, b, isdefined between adjacent recess trenches 525. The number and size of thespaces are determined by the profile and width of the entire transistorthat is to be formed later.

Referring to FIG. 7B, showing a cross-sectional view taken along lineI-I′ of FIG. 7A, the effective channel of the transistor is positionedalong the recess trench 525 formed in the active region 510. Theeffective channel length of the transistor increases proportionally tothe depth of the recess trench 525 formed in the semiconductor substrate500.

Referring to FIG. 8A to 8C, a gate insulating layer 530, a conductivelayer 535, a metal layer 540, and a hard mask layer 545 may besequentially deposited over the semiconductor substrate 500. The gateinsulating layer 530 may be formed of an oxide layer using an oxidationprocess, and the conductive layer 535 may be formed of a polysiliconlayer. The metal layer 540 may be formed of a tungsten (W) layer or atungsten silicide (WSix) layer, and the hard mask layer 545 may beformed of a nitride layer. A barrier metal layer (not shown) may bedeposited after the deposition of the conductive layer 535 but beforethe deposition of the metal layer 540.

Thereafter, a photoresist layer may be coated on the hard mask layer 545and patterned to form a photoresist layer pattern 550. A portion of thehard mask layer 545 may be blocked by the photoresist layer pattern 550.

The photoresist layer pattern 550 may be formed in a substantiallystraight line pattern and disposed to cross the recess trench 525 atapproximately right angles.

Referring to FIG. 8B, a cross-sectional view taken along line I-I′ ofFIG. 8A, layers stacked over the recess trench 525 are blocked by thephotoresist layer pattern 550 in the X-axis direction on thesemiconductor substrate 500. Referring to FIG. 8C, a cross-sectionalview taken along line II-II′ of FIG. 8A, an opening 555 of thephotoresist layer pattern 550 is formed in the Y-axis direction andexposes a portion of the hard mask layer 545. A gate line may be formedin a region blocked by the photoresist layer pattern 550.

Referring to FIG. 9A to 9C, the hard mask layer through the gateinsulating layer are entirely etched using a photoresist layer patternas a mask to form a gate line 580. The gate line 580 may include a gateinsulating layer pattern 560, a conductive layer pattern 565, a metallayer pattern 570, and a hard mask layer pattern 575, which may bestacked in sequence. In order to improve the uniformity of thetransistor, a gate dummy pattern 585 may be formed while the gate line580 is being formed on an active region 510. The gate dummy pattern 585and the gate line 580 may be formed, for example, simultaneously.

Referring to 9B, showing a cross-sectional view taken along line I-I′ ofFIG. 9A, the gate line 580 is formed in a substantially straight linepattern and disposed to cross a recess trench 525 at approximately rightangles. The effective channel C of the gate line 580 is positioned alongthe recess trenches 525. The length of the effective channel C is longerthan that of a flat panel type channel by approximately twice the depthof each recess trench 525.

The width W2 of the gate line 580 increases by approximately twice thedepth of each recess trench 525 in the active region 510. Accordingly, adesired effective channel length is ensured. In addition, the length ofthe effective channel C increases by approximately twice the depth ofeach recess trench 525, so that the width W2 of the gate line 580 can beshortened by the increased length of the effective channel C. Thus, thesize of an entire core region can be reduced. The length 12 of the gateline 580 is not changed since the gate line 580 has a straight linepattern, so that the length of the transistor is not changed. In a lightexposing process performed to form a gate line, the OPC process can beeffectively performed.

The above method for forming the gate line in a straight line patternand the recess trench in the active region to ensure the width of thetransistor can be used to form, for example, a YI transistor, a latchtransistor, a sub word line drive PMOS transistor, a main word linedrive transistor, and a Y decoder transistor. Referring to FIGS. 10 and11, gate lines 610 and 710 are formed along recess trenches 600 and 700in active regions, respectively. Accordingly, the widths W3 and W4 oftransistors increase proportionally to the depths of the recess trenches600 and 700, thereby increasing effective channel lengths.

The embodiments of the present invention have been disclosed above forillustrative purpose. Those skilled in the art will appreciate thatvarious modifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the invention as disclosed in theaccompanying claims.

1.-12. (canceled)
 13. A method for fabricating a transistor of asemiconductor device, the method comprising: forming an isolation layerto define an active region in a semiconductor substrate; forming arecess trench in the active region by etching the semiconductorsubstrate to a predetermined depth; and forming a gate line in asubstantially straight line pattern, overlapping the recess trench anddisposed to cross the recess trench at approximately right angles. 14.The method of claim 13, wherein the forming of the recess trenchcomprises: forming a photoresist layer pattern including an opening thatexposes a portion of the active region; and etching the exposed portionusing the photoresist layer pattern as a mask.
 15. The method of claim14, wherein the opening is formed in a rectangular type in which alength in a Y-axis direction is greater than a length in an X-axisdirection
 16. The method of claim 14, wherein the opening is formedwithin the active region.
 17. The method of claim 14, wherein theopening is formed in an island type.
 18. The method of claim 13, whereinthe forming of the gate line comprises: forming stacked layers for thegate line over the semiconductor substrate comprising the recess trench;forming a photoresist layer pattern over the stacked layers to bedisposed to cross the recess trench at approximately right angles in asubstantially straight line pattern, a portion of the stacked layersbeing blocked by the photoresist layer pattern; and forming the gateline by etching the stacked layers using the photoresist layer patternas a mask.
 19. The method of claim 13, further comprising, forming adummy pattern over the isolation layer while forming the gate line. 20.The method of claim 13, wherein the transistor is selected from thegroup consisting of a latch transistor, a sub word line drive PMOStransistor, a main word line drive transistor, a Y-decoder transistor,and a YI transistor.